BU4011BF-E1
vs
HD14011BFP
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
ROHM CO LTD
|
RENESAS TECHNOLOGY CORP
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
LSOP, SOP14,.25
|
SOP,
|
Pin Count |
14
|
14
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
4000/14000/40000
|
4000/14000/40000
|
JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
JESD-609 Code |
e2
|
|
Length |
8.7 mm
|
10.06 mm
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
NAND GATE
|
NAND GATE
|
Number of Functions |
4
|
4
|
Number of Inputs |
2
|
2
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LSOP
|
SOP
|
Package Equivalence Code |
SOP14,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, LOW PROFILE
|
SMALL OUTLINE
|
Packing Method |
TR
|
|
Prop. Delay@Nom-Sup |
180 ns
|
|
Propagation Delay (tpd) |
180 ns
|
250 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Schmitt Trigger |
NO
|
|
Seated Height-Max |
1.7 mm
|
2.2 mm
|
Supply Voltage-Max (Vsup) |
16 V
|
|
Supply Voltage-Min (Vsup) |
3 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN COPPER
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
4.4 mm
|
5.5 mm
|
Base Number Matches |
2
|
1
|
|
|
|
Compare BU4011BF-E1 with alternatives
Compare HD14011BFP with alternatives