BU4001BFT2
vs
MC14001BDR2
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROHM CO LTD
|
MOTOROLA INC
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
LSOP,
|
SOP, SOP14,.25
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
unknown
|
unknown
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| JESD-609 Code |
e2
|
e0
|
| Length |
8.7 mm
|
8.65 mm
|
| Logic IC Type |
NOR GATE
|
NOR GATE
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
16 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
TIN COPPER
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
|
| Width |
4.4 mm
|
3.9 mm
|
| Base Number Matches |
1
|
4
|
| HTS Code |
|
8542.39.00.01
|
| Load Capacitance (CL) |
|
50 pF
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Equivalence Code |
|
SOP14,.25
|
| Packing Method |
|
TR
|
| Propagation Delay (tpd) |
|
250 ns
|
| Schmitt Trigger |
|
NO
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Temperature Grade |
|
MILITARY
|
|
|
|
Compare BU4001BFT2 with alternatives
Compare MC14001BDR2 with alternatives