BU4001BFE2 vs 933372590652 feature comparison

BU4001BFE2 ROHM Semiconductor

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933372590652 NXP Semiconductors

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROHM CO LTD NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description LSOP, PLASTIC, SOT-108-1, SO-14
Pin Count 14 14
Reach Compliance Code unknown unknown
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e2 e4
Length 8.7 mm 8.65 mm
Logic IC Type NOR GATE NOR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Propagation Delay (tpd) 90 ns 120 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.75 mm
Supply Voltage-Max (Vsup) 16 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN COPPER Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 10 NOT SPECIFIED
Width 4.4 mm 3.9 mm
Base Number Matches 1 2
HTS Code 8542.39.00.01
Moisture Sensitivity Level 1

Compare BU4001BFE2 with alternatives

Compare 933372590652 with alternatives