BU4001BF-E2
vs
HEC4001BT,118
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ROHM CO LTD
NXP SEMICONDUCTORS
Part Package Code
SOIC
SOIC
Package Description
LSOP, SOP14,.25
SOP, SOP14,.25
Pin Count
14
14
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
ROHM Semiconductor
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e2
e4
Length
8.7 mm
8.65 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NOR GATE
NOR GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LSOP
SOP
Package Equivalence Code
SOP14,.25
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, LOW PROFILE
SMALL OUTLINE
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Propagation Delay (tpd)
90 ns
120 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
1.6 mm
1.75 mm
Supply Voltage-Max (Vsup)
16 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
Tin/Copper (Sn/Cu)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
4.4 mm
3.9 mm
Base Number Matches
1
2
Moisture Sensitivity Level
1
Prop. Delay@Nom-Sup
120 ns
Compare BU4001BF-E2 with alternatives
Compare HEC4001BT,118 with alternatives