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BU4001BF vs HEF4001BT,653 feature comparison

BU4001BF ROHM Semiconductor

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HEF4001BT,653 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ROHM CO LTD NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description LSOP, SOP14,.25 PLASTIC, SOT-108-1, SO-14
Pin Count 14 14
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e2 e4
Length 8.7 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NOR GATE NOR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSOP SOP
Package Equivalence Code SOP14,.25 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 90 ns 120 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.6 mm 1.75 mm
Supply Voltage-Max (Vsup) 16 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Copper (Sn/Cu) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 4.4 mm 3.9 mm
Base Number Matches 1 2
Manufacturer Package Code SOT108-1
Factory Lead Time 4 Weeks
Moisture Sensitivity Level 1
Packing Method TR
Prop. Delay@Nom-Sup 120 ns
Logic » Gates
Logic » Gates

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