BU2708DX
vs
2N5743.MOD
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
SEMELAB LTD
Part Package Code
SOT
TO-66
Package Description
FLANGE MOUNT, R-PSFM-T3
FLANGE MOUNT, O-MBFM-P2
Pin Count
3
2
Manufacturer Package Code
SOT399
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.29.00.95
Case Connection
ISOLATED
COLLECTOR
Collector Current-Max (IC)
8 A
20 A
Collector-Emitter Voltage-Max
825 V
60 V
Configuration
SINGLE WITH BUILT-IN DIODE AND RESISTOR
SINGLE
DC Current Gain-Min (hFE)
3
20
JESD-30 Code
R-PSFM-T3
O-MBFM-P2
Number of Elements
1
1
Number of Terminals
3
2
Operating Temperature-Max
150 °C
Package Body Material
PLASTIC/EPOXY
METAL
Package Shape
RECTANGULAR
ROUND
Package Style
FLANGE MOUNT
FLANGE MOUNT
Polarity/Channel Type
NPN
PNP
Power Dissipation Ambient-Max
45 W
Power Dissipation-Max (Abs)
45 W
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
NO
Terminal Form
THROUGH-HOLE
PIN/PEG
Terminal Position
SINGLE
BOTTOM
Transistor Application
SWITCHING
Transistor Element Material
SILICON
SILICON
Turn-off Time-Max (toff)
6020 ns
VCEsat-Max
1 V
Base Number Matches
1
1
JEDEC-95 Code
TO-213AA
Transition Frequency-Nom (fT)
10 MHz
Compare BU2708DX with alternatives
Compare 2N5743.MOD with alternatives