BU25TD3WG-TR
vs
LP2981IBP-3.3
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROHM CO LTD
|
NATIONAL SEMICONDUCTOR CORP
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
17 Weeks
|
|
| Samacsys Manufacturer |
ROHM Semiconductor
|
|
| Adjustability |
FIXED
|
FIXED
|
| Dropout Voltage1-Max |
0.54 V
|
0.375 V
|
| Dropout Voltage1-Nom |
0.28 V
|
0.2 V
|
| Input Voltage Absolute-Max |
6.5 V
|
16 V
|
| Input Voltage-Max |
6 V
|
16 V
|
| Input Voltage-Min |
3.5 V
|
4.3 V
|
| JESD-30 Code |
R-PDSO-G5
|
R-PBGA-B5
|
| Length |
2.9 mm
|
1.107 mm
|
| Line Regulation-Max |
0.02%
|
0.0124%
|
| Load Regulation-Max |
0.08%
|
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
5
|
5
|
| Operating Temperature TJ-Max |
125 °C
|
125 °C
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Current1-Max |
0.2 A
|
0.1 A
|
| Output Voltage1-Max |
2.525 V
|
3.4155 V
|
| Output Voltage1-Min |
2.475 V
|
3.1845 V
|
| Output Voltage1-Nom |
2.5 V
|
3.3 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
VFBGA
|
| Package Equivalence Code |
TSOP5/6,.11,37
|
BGA5,3X3,17/10
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Packing Method |
TR, EMBOSSED
|
TR
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
| Seated Height-Max |
1.45 mm
|
0.9 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BIPOLAR
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.95 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Voltage Tolerance-Max |
1%
|
3.5%
|
| Width |
1.6 mm
|
0.93 mm
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
VFBGA, BGA5,3X3,17/10
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
1
|
| Operating Temperature TJ-Min |
|
-40 °C
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare BU25TD3WG-TR with alternatives
Compare LP2981IBP-3.3 with alternatives