BU2515AF vs BU4507DF feature comparison

BU2515AF NXP Semiconductors

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BU4507DF Philips Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code SFM
Package Description FLANGE MOUNT, R-PSFM-T3 ,
Pin Count 3
Manufacturer Package Code SOT199
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.95
Case Connection ISOLATED
Collector Current-Max (IC) 9 A 8 A
Collector-Emitter Voltage-Max 800 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 5 4.2
JESD-30 Code R-PSFM-T3
Number of Elements 1 1
Number of Terminals 3
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style FLANGE MOUNT
Polarity/Channel Type NPN NPN
Power Dissipation Ambient-Max 45 W
Qualification Status Not Qualified
Surface Mount NO NO
Terminal Form THROUGH-HOLE
Terminal Position SINGLE
Transistor Application SWITCHING
Transistor Element Material SILICON
Turn-off Time-Max (toff) 3400 ns
VCEsat-Max 5 V
Base Number Matches 3 2
Rohs Code No
JESD-609 Code e0
Power Dissipation-Max (Abs) 45 W
Terminal Finish Tin/Lead (Sn/Pb)

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