BU2515AF
vs
BU4507DF
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SFM
|
|
| Package Description |
FLANGE MOUNT, R-PSFM-T3
|
FLANGE MOUNT, R-PSFM-T3
|
| Pin Count |
3
|
|
| Manufacturer Package Code |
SOT199
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.29.00.95
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Collector Current-Max (IC) |
9 A
|
8 A
|
| Collector-Emitter Voltage-Max |
800 V
|
800 V
|
| Configuration |
SINGLE
|
SINGLE WITH BUILT-IN DIODE AND RESISTOR
|
| DC Current Gain-Min (hFE) |
5
|
4.2
|
| JESD-30 Code |
R-PSFM-T3
|
R-PSFM-T3
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Polarity/Channel Type |
NPN
|
NPN
|
| Power Dissipation Ambient-Max |
45 W
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Turn-off Time-Max (toff) |
3400 ns
|
|
| VCEsat-Max |
5 V
|
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| Additional Feature |
|
BUILT-IN BIAS RESISTOR
|
| Power Dissipation-Max (Abs) |
|
45 W
|
|
|
|
Compare BU2515AF with alternatives
Compare BU4507DF with alternatives