BU2362FV-FE2
vs
CY22800FXC-036A
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROHM CO LTD
CYPRESS SEMICONDUCTOR CORP
Part Package Code
SOIC
SOIC
Package Description
LSSOP,
0.150 INCH, LEAD FREE, MS-012, SOIC-8
Pin Count
16
8
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G16
R-PDSO-G8
Length
5 mm
4.889 mm
Number of Terminals
16
8
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-25 °C
Output Clock Frequency-Max
36.864 MHz
36.864 MHz
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LSSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
SMALL OUTLINE
Primary Clock/Crystal Frequency-Nom
27 MHz
27 MHz
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.25 mm
1.727 mm
Supply Voltage-Max
3.6 V
3.47 V
Supply Voltage-Min
2.7 V
3.14 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
3.8985 mm
uPs/uCs/Peripheral ICs Type
CLOCK GENERATOR, OTHER
CLOCK GENERATOR, OTHER
Base Number Matches
1
1
Rohs Code
JESD-609 Code
e3
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Terminal Finish
MATTE TIN
Time@Peak Reflow Temperature-Max (s)
20
Compare BU2362FV-FE2 with alternatives
Compare CY22800FXC-036A with alternatives