BU-65863FD-163 vs BU-65863FD-463 feature comparison

BU-65863FD-163 Data Device Corporation

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BU-65863FD-463 Data Device Corporation

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Rohs Code No No
Part Life Cycle Code Active Active
Ihs Manufacturer DATA DEVICE CORP DATA DEVICE CORP
Package Description QFF, QFL80,.89SQ,40 QFF, QFL80,.89SQ,40
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature LG-MAX; WD-MAX LG-MAX; WD-MAX
Address Bus Width 32 32
Boundary Scan YES YES
Bus Compatibility PCI PCI
Clock Frequency-Max 20 MHz 20 MHz
Communication Protocol MIL-STD-1553A; MIL-STD-1553B; MIL-STD-1760; MCAIR; STANAG-3838 MIL-STD-1553A; MIL-STD-1553B; MIL-STD-1760; MCAIR; STANAG-3838
Data Encoding/Decoding Method BIPH-LEVEL(MANCHESTER) BIPH-LEVEL(MANCHESTER)
Data Transfer Rate-Max 0.125 MBps 0.125 MBps
External Data Bus Width 32 32
JESD-30 Code S-CQFP-F80 S-CQFP-F80
JESD-609 Code e0 e0
Length 22.606 mm 22.606 mm
Low Power Mode YES YES
Number of Serial I/Os 2 2
Number of Terminals 80 80
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QFF QFF
Package Equivalence Code QFL80,.89SQ,40 QFL80,.89SQ,40
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38534 MIL-PRF-38534
Seated Height-Max 3.302 mm 3.302 mm
Supply Voltage-Max 3.45 V 3.45 V
Supply Voltage-Min 3.15 V 3.15 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form FLAT FLAT
Terminal Pitch 1.016 mm 1.016 mm
Terminal Position QUAD QUAD
Width 22.606 mm 22.606 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
Base Number Matches 1 1

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