BU-65863F4-590Y
vs
BU-65843G3-400Q
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
DATA DEVICE CORP
|
DATA DEVICE CORP
|
| Package Description |
QFF,
|
QFP,
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Bus Compatibility |
PCI
|
PCI
|
| Clock Frequency-Max |
20 MHz
|
33.3 MHz
|
| Communication Protocol |
MIL-STD-1553A; MIL-STD-1553B; MCAIR; STANAG-3838
|
MIL STD 1553A; MIL STD 1553B
|
| Data Encoding/Decoding Method |
BIPH-LEVEL(MANCHESTER)
|
BIPH-LEVEL (MANCHESTER)
|
| Data Transfer Rate-Max |
0.125 MBps
|
1 MBps
|
| External Data Bus Width |
32
|
32
|
| JESD-30 Code |
S-CQFP-F80
|
S-CQFP-G80
|
| Length |
22.606 mm
|
22.35 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Serial I/Os |
2
|
2
|
| Number of Terminals |
80
|
80
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QFF
|
QFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Seated Height-Max |
3.302 mm
|
3.708 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
FLAT
|
GULL WING
|
| Terminal Pitch |
1.016 mm
|
1.016 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
22.606 mm
|
22.35 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
|
SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
SEATED HT-CALCULATED
|
| Package Equivalence Code |
|
QFP80,1.1SQ,40
|
| Screening Level |
|
MIL-PRF-38534
|
|
|
|
Compare BU-65863F4-590Y with alternatives
Compare BU-65843G3-400Q with alternatives