BU-65171V1-540 vs BU-65170V1-350 feature comparison

BU-65171V1-540 Data Device Corporation

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BU-65170V1-350 Data Device Corporation

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Part Life Cycle Code Active Active
Ihs Manufacturer DATA DEVICE CORP DATA DEVICE CORP
Package Description 1.900 INCH, CERAMIC, DFP-70 DFP, FL70,1.0
Pin Count 70 70
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature LG-MAX; WD-MAX LG-MAX; WD-MAX
Address Bus Width 16 16
Boundary Scan NO NO
Clock Frequency-Max 16 MHz 16 MHz
Communication Protocol MIL STD 1553A; MIL STD 1553B; MIL STD 1760; MCAIR; STANAG-3838 MIL STD 1553A; MIL STD 1553B; MIL STD 1760; MCAIR; STANAG-3838
Data Encoding/Decoding Method NRZ; BIPH-LEVEL(MANCHESTER) NRZ; BIPH-LEVEL(MANCHESTER)
Data Transfer Rate-Max 0.125 MBps 0.125 MBps
External Data Bus Width 16 16
JESD-30 Code R-CDFP-F70 R-CDFP-F70
JESD-609 Code e4 e4
Length 48.26 mm 48.26 mm
Low Power Mode YES YES
Number of Serial I/Os 2 2
Number of Terminals 70 70
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DFP DFP
Package Equivalence Code FL70,1.0 FL70,1.0
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK FLATPACK
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38534 MIL-PRF-38534
Seated Height-Max 3.81 mm 3.81 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish GOLD OVER NICKEL GOLD OVER NICKEL
Terminal Form FLAT FLAT
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 25.4 mm 25.4 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
Base Number Matches 1 1

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