BU-63825F0-480Z
vs
BU-63825G0-160Q
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
DATA DEVICE CORP
|
DATA DEVICE CORP
|
Package Description |
DFP,
|
SOP,
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
LG-MAX, WD-MAX
|
LG-MAX, WD-MAX
|
Address Bus Width |
16
|
16
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
16 MHz
|
16 MHz
|
Communication Protocol |
MIL-STD-1553A; MIL-STD-1553B; MCAIR; STANAG-3838
|
MIL-STD-1553A; MIL-STD-1553B; MCAIR; STANAG-3838
|
Data Encoding/Decoding Method |
BIPH-LEVEL(MANCHESTER)
|
BIPH-LEVEL(MANCHESTER)
|
Data Transfer Rate-Max |
0.125 MBps
|
0.125 MBps
|
External Data Bus Width |
16
|
16
|
JESD-30 Code |
R-CDFP-F70
|
R-CDSO-G70
|
JESD-609 Code |
e0
|
|
Length |
48.26 mm
|
48.26 mm
|
Low Power Mode |
YES
|
YES
|
Number of Serial I/Os |
|
|
Number of Terminals |
70
|
70
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DFP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
SMALL OUTLINE
|
Seated Height-Max |
5.46 mm
|
5.461 mm
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
FLAT
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
25.4 mm
|
25.4 mm
|
uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
|
SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
|
Base Number Matches |
1
|
1
|
|
|
|
Compare BU-63825F0-480Z with alternatives
Compare BU-63825G0-160Q with alternatives