BU-61864F3-130K vs BU-61864F3-130Q feature comparison

BU-61864F3-130K Data Device Corporation

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BU-61864F3-130Q Data Device Corporation

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Active Active
Ihs Manufacturer DATA DEVICE CORP DATA DEVICE CORP
Part Package Code QFP QFP
Package Description QFF, QFF,
Pin Count 72 72
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 16 16
Boundary Scan NO NO
Clock Frequency-Max 20 MHz 20 MHz
Communication Protocol ASYNC, BIT; SYNC, BYTE ASYNC, BIT; SYNC, BYTE
Data Encoding/Decoding Method BIPH-LEVEL(MANCHESTER) BIPH-LEVEL(MANCHESTER)
Data Transfer Rate-Max 0.125 MBps 0.125 MBps
External Data Bus Width 16 16
JESD-30 Code S-CQFP-F72 S-CQFP-F72
JESD-609 Code e0 e0
Length 25.4 mm 25.4 mm
Low Power Mode YES YES
Number of Serial I/Os 2 2
Number of Terminals 72 72
On Chip Data RAM Width 17 17
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QFF QFF
Package Equivalence Code QFL72,1.0SQ QFL72,1.0SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Qualification Status Not Qualified Not Qualified
RAM (words) 65536 65536
Screening Level MIL-PRF-38534 Class H MIL-PRF-38534 Class H
Seated Height-Max 2.54 mm 2.54 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form FLAT FLAT
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 25.4 mm 25.4 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
Base Number Matches 1 1

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