BU-61581G2-140K
vs
BU-61583F6-200K
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
DATA DEVICE CORP
|
DATA DEVICE CORP
|
Part Package Code |
SOIC
|
DFP
|
Package Description |
SOP,
|
CERAMIC, DFP-70
|
Pin Count |
70
|
70
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
16
|
16
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
16 MHz
|
16 MHz
|
Communication Protocol |
MIL-STD-1553A; MIL-STD-1553B
|
MIL-STD-1553A; MIL-STD-1553B; MCAIR; STANAG-3838
|
Data Encoding/Decoding Method |
BIPH-LEVEL(MANCHESTER)
|
BIPH-LEVEL(MANCHESTER)
|
Data Transfer Rate-Max |
0.125 MBps
|
0.125 MBps
|
External Data Bus Width |
16
|
16
|
JESD-30 Code |
R-CDSO-G70
|
R-CDFP-F70
|
JESD-609 Code |
e0
|
e0
|
Length |
48.26 mm
|
|
Low Power Mode |
NO
|
NO
|
Number of Serial I/Os |
2
|
2
|
Number of Terminals |
70
|
70
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
SOP
|
DFP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.81 mm
|
5.46 mm
|
Supply Voltage-Max |
5.5 V
|
5.25 V
|
Supply Voltage-Min |
4.5 V
|
4.75 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
FLAT
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
25.4 mm
|
|
uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
|
SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
|
Base Number Matches |
1
|
1
|
|
|
|
Compare BU-61581G2-140K with alternatives
Compare BU-61583F6-200K with alternatives