BSR56
vs
BSR56,215
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
NXP SEMICONDUCTORS
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
FET Technology
JUNCTION
JUNCTION
JESD-609 Code
e3
e3
Operating Temperature-Max
150 °C
150 °C
Peak Reflow Temperature (Cel)
260
260
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Power Dissipation-Max (Abs)
0.3 W
0.3 W
Surface Mount
YES
YES
Terminal Finish
MATTE TIN
TIN
Base Number Matches
10
1
Part Package Code
TO-236
Package Description
PLASTIC, SMD, SST3, 3 PIN
Pin Count
3
Manufacturer Package Code
SOT23
HTS Code
8541.21.00.95
Samacsys Manufacturer
NXP
Configuration
SINGLE
DS Breakdown Voltage-Min
40 V
Drain Current-Max (ID)
0.02 A
Drain-source On Resistance-Max
25 Ω
Feedback Cap-Max (Crss)
5 pF
JESD-30 Code
R-PDSO-G3
Moisture Sensitivity Level
1
Number of Elements
1
Number of Terminals
3
Operating Mode
DEPLETION MODE
Package Body Material
PLASTIC/EPOXY
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE
Qualification Status
Not Qualified
Terminal Form
GULL WING
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Transistor Application
SWITCHING
Transistor Element Material
SILICON
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