BSP89
vs
BSP89-TAPE-13
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ZETEX PLC
|
NXP SEMICONDUCTORS
|
| Package Description |
,
|
SMALL OUTLINE, R-PDSO-G4
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Configuration |
SINGLE
|
SINGLE WITH BUILT-IN DIODE
|
| Drain Current-Max (ID) |
0.34 A
|
0.35 A
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| JESD-609 Code |
e0
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Power Dissipation-Max (Abs) |
1.5 W
|
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN LEAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
|
| Base Number Matches |
8
|
1
|
| Case Connection |
|
DRAIN
|
| DS Breakdown Voltage-Min |
|
240 V
|
| Drain-source On Resistance-Max |
|
10 Ω
|
| Feedback Cap-Max (Crss) |
|
9 pF
|
| JESD-30 Code |
|
R-PDSO-G4
|
| Number of Terminals |
|
4
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Pulsed Drain Current-Max (IDM) |
|
1.4 A
|
| Qualification Status |
|
Not Qualified
|
| Terminal Form |
|
GULL WING
|
| Terminal Position |
|
DUAL
|
| Transistor Application |
|
SWITCHING
|
| Transistor Element Material |
|
SILICON
|
| Turn-off Time-Max (toff) |
|
30 ns
|
| Turn-on Time-Max (ton) |
|
10 ns
|
|
|
|
Compare BSP89-TAPE-13 with alternatives