BSP60,115
vs
BSP60
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
SIEMENS A G
Part Package Code
SC-73
Package Description
PLASTIC, SMD, SC-73, 4 PIN
SMALL OUTLINE, R-PDSO-G4
Pin Count
4
Manufacturer Package Code
SOT223
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.29.00.75
8541.29.00.75
Factory Lead Time
4 Weeks
Case Connection
COLLECTOR
COLLECTOR
Collector Current-Max (IC)
1 A
1 A
Collector-Emitter Voltage-Max
45 V
45 V
Configuration
DARLINGTON WITH BUILT-IN DIODE AND RESISTOR
DARLINGTON
DC Current Gain-Min (hFE)
2000
2000
JESD-30 Code
R-PDSO-G4
R-PDSO-G4
JESD-609 Code
e3
e0
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
4
4
Operating Temperature-Max
150 °C
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Polarity/Channel Type
PNP
PNP
Power Dissipation Ambient-Max
1.5 W
1.5 W
Power Dissipation-Max (Abs)
1.5 W
1.5 W
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Finish
TIN
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Transistor Application
SWITCHING
Transistor Element Material
SILICON
SILICON
Transition Frequency-Nom (fT)
200 MHz
200 MHz
VCEsat-Max
1.3 V
1.8 V
Base Number Matches
1
1
Turn-off Time-Max (toff)
1500 ns
Turn-on Time-Max (ton)
400 ns
Compare BSP60,115 with alternatives
Compare BSP60 with alternatives