BSP296L6327 vs BUK581-100A feature comparison

BSP296L6327 Infineon Technologies AG

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BUK581-100A Philips Semiconductors

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INFINEON TECHNOLOGIES AG PHILIPS SEMICONDUCTORS
Package Description GREEN, PLASTIC PACKAGE-4 ,
Pin Count 4
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
Additional Feature LOGIC LEVEL COMPATIBLE
Case Connection DRAIN
Configuration SINGLE WITH BUILT-IN DIODE SINGLE
DS Breakdown Voltage-Min 100 V
Drain Current-Max (ID) 1.1 A 0.9 A
Drain-source On Resistance-Max 0.7 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JESD-30 Code R-PDSO-G4
JESD-609 Code e3 e0
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 4
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type N-CHANNEL N-CHANNEL
Power Dissipation-Max (Abs) 1.79 W 1.5 W
Pulsed Drain Current-Max (IDM) 4.4 A
Qualification Status Not Qualified
Surface Mount YES YES
Terminal Finish MATTE TIN Tin/Lead (Sn/Pb)
Terminal Form GULL WING
Terminal Position DUAL
Transistor Element Material SILICON
Base Number Matches 1 3

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