BSN20
vs
BSN20,215
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
NXP SEMICONDUCTORS
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
Configuration
SINGLE
SINGLE WITH BUILT-IN DIODE
Drain Current-Max (ID)
0.1 A
0.173 A
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Operating Temperature-Max
150 °C
150 °C
Peak Reflow Temperature (Cel)
260
260
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Power Dissipation-Max (Abs)
0.3 W
0.3 W
Surface Mount
YES
YES
Terminal Finish
MATTE TIN
TIN
Base Number Matches
4
2
Part Package Code
TO-236
Pin Count
3
Manufacturer Package Code
SOT23
HTS Code
8541.21.00.95
Factory Lead Time
4 Weeks
Samacsys Manufacturer
NXP
Additional Feature
LOGIC LEVEL COMPATIBLE
DS Breakdown Voltage-Min
50 V
Drain-source On Resistance-Max
20 Ω
Feedback Cap-Max (Crss)
8 pF
JESD-30 Code
R-PDSO-G3
Number of Terminals
3
Package Body Material
PLASTIC/EPOXY
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE
Qualification Status
Not Qualified
Terminal Form
GULL WING
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Transistor Application
SWITCHING
Transistor Element Material
SILICON
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