BS616LV8017FAG70 vs HY62LF16804A-SM70C feature comparison

BS616LV8017FAG70 Brilliance Semiconductor Inc

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HY62LF16804A-SM70C SK Hynix Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer BRILLIANCE SEMICONDUCTOR INC SK HYNIX INC
Part Package Code BGA BGA
Package Description TFBGA, VFBGA, BGA48,6X8,30
Pin Count 48 48
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 70 ns
JESD-30 Code R-PBGA-B48 R-PBGA-B48
Length 12 mm 8.5 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 1.2 mm 0.95 mm
Supply Voltage-Max (Vsup) 5.5 V 2.7 V
Supply Voltage-Min (Vsup) 2.4 V 2.3 V
Supply Voltage-Nom (Vsup) 3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Width 9 mm 7.4 mm
Base Number Matches 1 1
I/O Type COMMON
JESD-609 Code e1
Output Characteristics 3-STATE
Package Equivalence Code BGA48,6X8,30
Qualification Status Not Qualified
Standby Voltage-Min 1.2 V
Supply Current-Max 0.03 mA
Terminal Finish TIN SILVER COPPER

Compare BS616LV8017FAG70 with alternatives

Compare HY62LF16804A-SM70C with alternatives