BS170
vs
BSS192
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TO-92
|
SOT-89
|
| Package Description |
TO-92, 3 PIN
|
SMALL OUTLINE, R-PSSO-F3
|
| Pin Count |
3
|
3
|
| Manufacturer Package Code |
3LD, TO-92, MOLDED, STD STRAIGHT LD (NO EOL CODE)
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
| DS Breakdown Voltage-Min |
60 V
|
240 V
|
| Drain Current-Max (ID) |
0.5 A
|
0.2 A
|
| Drain-source On Resistance-Max |
5 Ω
|
12 Ω
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| Feedback Cap-Max (Crss) |
10 pF
|
15 pF
|
| JEDEC-95 Code |
TO-92
|
TO-243AA
|
| JESD-30 Code |
O-PBCY-T3
|
R-PSSO-F3
|
| JESD-609 Code |
e1
|
e3
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
CYLINDRICAL
|
SMALL OUTLINE
|
| Polarity/Channel Type |
N-CHANNEL
|
P-CHANNEL
|
| Power Dissipation-Max (Abs) |
0.83 W
|
1 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
YES
|
| Terminal Finish |
TIN SILVER COPPER
|
Tin (Sn)
|
| Terminal Form |
THROUGH-HOLE
|
FLAT
|
| Terminal Position |
BOTTOM
|
SINGLE
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
31
|
11
|
| HTS Code |
|
8541.29.00.75
|
| Samacsys Manufacturer |
|
NXP
|
| Additional Feature |
|
CMOS COMPATIBLE
|
| Case Connection |
|
DRAIN
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare BS170 with alternatives
Compare BSS192 with alternatives