BS107ARLRP
vs
BS107AG
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
ONSEMI
|
Package Description |
,
|
CASE 29-11, TO-92, 3 PIN
|
Reach Compliance Code |
unknown
|
unknown
|
Configuration |
Single
|
SINGLE WITH BUILT-IN DIODE
|
Drain Current-Max (Abs) (ID) |
0.25 A
|
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Power Dissipation-Max (Abs) |
0.6 W
|
0.35 W
|
Surface Mount |
NO
|
NO
|
Base Number Matches |
5
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
TO-92 (TO-226) 5.33mm Body Height
|
Pin Count |
|
3
|
Manufacturer Package Code |
|
29-11
|
ECCN Code |
|
EAR99
|
Samacsys Manufacturer |
|
onsemi
|
DS Breakdown Voltage-Min |
|
200 V
|
Drain Current-Max (ID) |
|
0.25 A
|
Drain-source On Resistance-Max |
|
6.4 Ω
|
JEDEC-95 Code |
|
TO-226AA
|
JESD-30 Code |
|
O-PBCY-T3
|
JESD-609 Code |
|
e1
|
Number of Elements |
|
1
|
Number of Terminals |
|
3
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Shape |
|
ROUND
|
Package Style |
|
CYLINDRICAL
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
|
THROUGH-HOLE
|
Terminal Position |
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
Transistor Application |
|
SWITCHING
|
Transistor Element Material |
|
SILICON
|
|
|
|
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