BR5006
vs
TS50P05GD2G
feature comparison
Part Life Cycle Code |
Contact Manufacturer
|
Active
|
Ihs Manufacturer |
HY ELECTRONIC CORP
|
TAIWAN SEMICONDUCTOR CO LTD
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Case Connection |
ISOLATED
|
|
Configuration |
BRIDGE, 4 ELEMENTS
|
BRIDGE, 4 ELEMENTS
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
BRIDGE RECTIFIER DIODE
|
BRIDGE RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1.1 V
|
1.1 V
|
JESD-30 Code |
S-XUFM-D4
|
R-PSFM-T4
|
Non-rep Pk Forward Current-Max |
500 A
|
400 A
|
Number of Elements |
4
|
4
|
Number of Phases |
1
|
1
|
Number of Terminals |
4
|
4
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Current-Max |
50 A
|
50 A
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
Rep Pk Reverse Voltage-Max |
600 V
|
600 V
|
Reverse Current-Max |
10 µA
|
|
Surface Mount |
NO
|
NO
|
Terminal Form |
SOLDER LUG
|
THROUGH-HOLE
|
Terminal Position |
UPPER
|
SINGLE
|
Base Number Matches |
9
|
1
|
Rohs Code |
|
Yes
|
Breakdown Voltage-Min |
|
600 V
|
JESD-609 Code |
|
e3
|
Peak Reflow Temperature (Cel) |
|
260
|
Reference Standard |
|
AEC-Q101; IEC-61000-4-2; UL RECOGNIZED
|
Terminal Finish |
|
MATTE TIN
|
Time@Peak Reflow Temperature-Max (s) |
|
10
|
|
|
|
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