BR25L020FJ-W
vs
BR25L020F-W
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ROHM CO LTD
|
ROHM CO LTD
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOP, SOP8,.25
|
LSOP, SOP8,.25
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
5 MHz
|
5 MHz
|
| Data Retention Time-Min |
40
|
40
|
| Endurance |
1000000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e2
|
e2
|
| Length |
4.9 mm
|
5 mm
|
| Memory Density |
2048 bit
|
2048 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
256 words
|
256 words
|
| Number of Words Code |
256
|
256
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
256X8
|
256X8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
LSOP
|
| Package Equivalence Code |
SOP8,.25
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, LOW PROFILE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Serial Bus Type |
SPI
|
SPI
|
| Standby Current-Max |
0.000002 A
|
0.000002 A
|
| Supply Current-Max |
0.003 mA
|
0.003 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
1.8 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Copper (Sn/Cu)
|
Tin/Copper (Sn/Cu)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
3.9 mm
|
4.4 mm
|
| Write Cycle Time-Max (tWC) |
5 ms
|
5 ms
|
| Write Protection |
HARDWARE/SOFTWARE
|
HARDWARE/SOFTWARE
|
| Base Number Matches |
3
|
3
|
| Seated Height-Max |
|
1.6 mm
|
|
|
|