BR24T16FV-WGE2
vs
M24C16-FBN6G
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
ROHM CO LTD
STMICROELECTRONICS
Part Package Code
SOIC
Package Description
SOP, SSOP8,.25
DIP,
Pin Count
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
0.4 MHz
0.4 MHz
Data Retention Time-Min
40
Endurance
1000000 Write/Erase Cycles
I2C Control Byte
1010MMMR
JESD-30 Code
R-PDSO-G8
R-PDIP-T8
Memory Density
16384 bit
16384 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2KX8
2KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SSOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Serial Bus Type
MICROWIRE
I2C
Standby Current-Max
0.000002 A
Supply Current-Max
0.002 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
2.5 V
1.8 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.635 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Write Cycle Time-Max (tWC)
5 ms
5 ms
Write Protection
HARDWARE
Base Number Matches
1
1
Length
9.27 mm
Seated Height-Max
5.33 mm
Width
7.62 mm
Compare BR24T16FV-WGE2 with alternatives
Compare M24C16-FBN6G with alternatives