BR24T04-W
vs
F25S04PA-50DG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ROHM CO LTD
ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC
Package Description
DIP, DIP8,.3
DIP,
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
0.4 MHz
50 MHz
Data Retention Time-Min
40
Endurance
1000000 Write/Erase Cycles
I2C Control Byte
1010DDMR
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e3
Length
9.3 mm
9.27 mm
Memory Density
4096 bit
4194304 bit
Memory IC Type
EEPROM
FLASH
Memory Width
8
8
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
512 words
524288 words
Number of Words Code
512
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
512X8
512KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.21 mm
5 mm
Serial Bus Type
I2C
SPI
Standby Current-Max
0.000002 A
Supply Current-Max
0.002 mA
Supply Voltage-Max (Vsup)
5.5 V
3.3 V
Supply Voltage-Min (Vsup)
1.6 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Matte Tin (Sn)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
7.62 mm
Write Cycle Time-Max (tWC)
5 ms
Write Protection
HARDWARE
HARDWARE/SOFTWARE
Base Number Matches
1
1
Part Package Code
DIP
Pin Count
8
Output Characteristics
3-STATE
Programming Voltage
3.3 V
Type
NOR TYPE
Compare BR24T04-W with alternatives
Compare F25S04PA-50DG with alternatives