BR24L16-W
vs
X24645AI-2.7
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ROHM CO LTD
|
XICOR INC
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP8,.3
|
SOP, SOP8,.3
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.51
|
|
| Samacsys Manufacturer |
ROHM Semiconductor
|
|
| Clock Frequency-Max (fCLK) |
0.4 MHz
|
0.1 MHz
|
| Data Retention Time-Min |
40
|
100
|
| Endurance |
1000000 Write/Erase Cycles
|
100000 Write/Erase Cycles
|
| I2C Control Byte |
1010MMMR
|
DDMMMMMR
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G8
|
| JESD-609 Code |
e3/e2
|
e0
|
| Length |
9.3 mm
|
5.31 mm
|
| Memory Density |
16384 bit
|
65536 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
2048 words
|
8192 words
|
| Number of Words Code |
2000
|
8000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
2KX8
|
8KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP8,.3
|
SOP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.7 mm
|
2.03 mm
|
| Serial Bus Type |
I2C
|
I2C
|
| Standby Current-Max |
0.000002 A
|
0.000001 A
|
| Supply Current-Max |
0.002 mA
|
0.003 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN/TIN COPPER
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
|
| Width |
7.62 mm
|
5.27 mm
|
| Write Cycle Time-Max (tWC) |
5 ms
|
10 ms
|
| Write Protection |
HARDWARE
|
HARDWARE/SOFTWARE
|
| Base Number Matches |
1
|
2
|
| Additional Feature |
|
2 WIRE SERIAL INTERFACE
|
| Output Characteristics |
|
OPEN-DRAIN
|
|
|
|
Compare BR24L16-W with alternatives
Compare X24645AI-2.7 with alternatives