BR24G16FVJ-3GTE2 vs M24C16-FBN5TG feature comparison

BR24G16FVJ-3GTE2 ROHM Semiconductor

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M24C16-FBN5TG STMicroelectronics

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Rohs Code Yes
Part Life Cycle Code Not Recommended Active
Ihs Manufacturer ROHM CO LTD STMICROELECTRONICS
Package Description TSSOP-8 DIP,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Samacsys Manufacturer ROHM Semiconductor
Clock Frequency-Max (fCLK) 0.4 MHz 0.4 MHz
Data Retention Time-Min 40
Endurance 1000000 Write/Erase Cycles
I2C Control Byte 1010MMMR
JESD-30 Code S-PDSO-G8 R-PDIP-T8
JESD-609 Code e3
Length 3 mm 9.27 mm
Memory Density 16384 bit 16384 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -20 °C
Organization 2KX8 2KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP DIP
Package Equivalence Code TSSOP8,.19
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 3 V
Seated Height-Max 1.1 mm 5.33 mm
Serial Bus Type I2C I2C
Standby Current-Max 0.000002 A
Supply Current-Max 0.002 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.6 V 1.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish Tin (Sn)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3 mm 7.62 mm
Write Cycle Time-Max (tWC) 5 ms 5 ms
Write Protection SOFTWARE
Base Number Matches 1 1

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