BR100/03LLD
vs
TCLLDB3
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TAK CHEONG ELECTRONICS HOLDINGS CO LTD
|
| Package Description |
GLASS PACKAGE-2
|
LONG FORM, O-LELF-R2
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.30.00.80
|
8541.30.00.80
|
| Breakover Voltage-Max |
36 V
|
36 V
|
| Breakover Voltage-Min |
28 V
|
28 V
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
100 °C
|
125 °C
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
| Terminal Position |
END
|
END
|
| Trigger Device Type |
DIAC
|
DIAC
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
DO-213AC
|
| JEDEC-95 Code |
|
DO-213AC
|
| JESD-609 Code |
|
e3
|
| Operating Temperature-Min |
|
-40 °C
|
| Terminal Finish |
|
TIN
|
|
|
|
Compare BR100/03LLD with alternatives
Compare TCLLDB3 with alternatives