BQ51011YFFT vs BQ51013RHLR feature comparison

BQ51011YFFT Texas Instruments

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BQ51013RHLR Texas Instruments

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code End Of Life Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA QFN
Package Description DSBGA-28 HVQCCN,
Pin Count 28 20
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments
JESD-30 Code R-XBGA-B28 R-PQCC-N20
JESD-609 Code e1
Length 2.76 mm 4.5 mm
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 28 20
Operating Temperature-Max 125 °C
Operating Temperature-Min
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code VFBGA HVQCCN
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.625 mm 1 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type TELECOM CIRCUIT TELECOM CIRCUIT
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL NO LEAD
Terminal Pitch 0.4 mm 0.5 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 1.56 mm 3.5 mm
Base Number Matches 1 1

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