BQ27505YZGT-J3
vs
BQ27505YZGR-J4
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Package Description
DSBGA-12
2.43 X 1.96 MM, 0.50 MM PITCH, GREEN, DSBGA-12
Pin Count
12
12
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Texas Instruments
Texas Instruments
Adjustable Threshold
YES
YES
Analog IC - Other Type
POWER SUPPLY SUPPORT CIRCUIT
POWER SUPPLY SUPPORT CIRCUIT
JESD-30 Code
R-XBGA-B12
R-XBGA-B12
JESD-609 Code
e1
e1
Length
2.295 mm
2.295 mm
Moisture Sensitivity Level
1
1
Number of Channels
1
1
Number of Functions
1
1
Number of Terminals
12
12
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
VFBGA
VFBGA
Package Equivalence Code
BGA12,3X4,20
BGA12,3X4,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.625 mm
0.625 mm
Supply Voltage-Max (Vsup)
2.6 V
2.6 V
Supply Voltage-Min (Vsup)
2.4 V
2.4 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
1.795 mm
1.795 mm
Base Number Matches
1
1
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