BQ27425YZFT-G2B
vs
MAX17047G+T10
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Package Description |
DSBGA-15
|
3 X 3 MM, ROHS COMPLIANT, TDFN-10
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
Additional Feature |
ALSO OPERATES WITH SUPPLY VOLTAGE 2.45 TO 2.8V
|
|
Adjustable Threshold |
NO
|
NO
|
Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
JESD-30 Code |
R-XBGA-B15
|
S-PDSO-N10
|
JESD-609 Code |
e1
|
e3
|
Length |
2.69 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
15
|
10
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
HVSON
|
Package Equivalence Code |
BGA15,3X5,20
|
SOLCC10,.12,20
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
0.625 mm
|
0.8 mm
|
Supply Voltage-Max (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Min (Vsup) |
2.8 V
|
2.5 V
|
Supply Voltage-Nom (Vsup) |
3.6 V
|
3.6 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
MATTE TIN
|
Terminal Form |
BALL
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
1.75 mm
|
3 mm
|
Base Number Matches |
1
|
2
|
Part Package Code |
|
DFN
|
Pin Count |
|
10
|
Qualification Status |
|
Not Qualified
|
Supply Current-Max (Isup) |
|
0.042 mA
|
|
|
|
Compare BQ27425YZFT-G2B with alternatives
Compare MAX17047G+T10 with alternatives