BQ25896RTWR
vs
X40015V8-B
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
XICOR INC
|
| Part Package Code |
QFN
|
|
| Package Description |
WQFN-24
|
PLASTIC, TSSOP-8
|
| Pin Count |
24
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Adjustable Threshold |
YES
|
YES
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
VOLTAGE SUPERVISOR/RESET IC
|
| Input Voltage-Max |
14 V
|
|
| Input Voltage-Min |
3.9 V
|
|
| JESD-30 Code |
S-PQCC-N24
|
R-PDSO-G8
|
| JESD-609 Code |
e4
|
e0
|
| Length |
4 mm
|
4.4 mm
|
| Moisture Sensitivity Level |
2
|
|
| Number of Channels |
1
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
8
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
TSSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
0.8 mm
|
1.2 mm
|
| Supply Current-Max (Isup) |
3 mA
|
3 mA
|
| Supply Voltage-Max (Vsup) |
14 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
3.9 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
BUCK
|
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
4 mm
|
3 mm
|
| Base Number Matches |
1
|
3
|
| Package Equivalence Code |
|
TSSOP8,.25
|
| Qualification Status |
|
Not Qualified
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Technology |
|
CMOS
|
|
|
|
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