BQ25120YFPT
vs
BQ25120YFPR
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Not Recommended
|
Not Recommended
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
DSBGA-25
|
VFBGA,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Adjustable Threshold |
YES
|
YES
|
Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT
|
POWER SUPPLY MANAGEMENT CIRCUIT
|
Input Voltage-Max |
5.5 V
|
5.5 V
|
Input Voltage-Min |
3.4 V
|
3.4 V
|
JESD-30 Code |
R-PBGA-B25
|
R-PBGA-B25
|
JESD-609 Code |
e1
|
e1
|
Length |
2.53 mm
|
2.53 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
25
|
25
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA25,5X5,16
|
BGA25,5X5,16
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
0.5 mm
|
0.5 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
3.4 V
|
3.4 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.4 mm
|
0.4 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
2.468 mm
|
2.468 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare BQ25120YFPT with alternatives
Compare BQ25120YFPR with alternatives