BQ24295RGET
vs
BQ25157YFPR
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
VQFN-24
|
DSBGA-20
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Adjustable Threshold |
YES
|
YES
|
Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT
|
POWER SUPPLY MANAGEMENT CIRCUIT
|
Input Voltage-Max |
6.2 V
|
6.1 V
|
Input Voltage-Min |
3.9 V
|
3.4 V
|
JESD-30 Code |
S-PQCC-N24
|
R-PBGA-B20
|
JESD-609 Code |
e4
|
e1
|
Length |
4 mm
|
2.015 mm
|
Moisture Sensitivity Level |
2
|
1
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
20
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
VFBGA
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
1 mm
|
0.5 mm
|
Supply Current-Max (Isup) |
3 mA
|
0.5 mA
|
Supply Voltage-Max (Vsup) |
6.2 V
|
6.1 V
|
Supply Voltage-Min (Vsup) |
3.9 V
|
3.4 V
|
Surface Mount |
YES
|
YES
|
Switcher Configuration |
BUCK
|
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN SILVER COPPER
|
Terminal Form |
NO LEAD
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.4 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Threshold Voltage-Nom |
+6.4V
|
+6.2V
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
4 mm
|
1.615 mm
|
Base Number Matches |
1
|
1
|
Package Equivalence Code |
|
BGA20,4X5,16
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
|
|
|
Compare BQ24295RGET with alternatives
Compare BQ25157YFPR with alternatives