BQ24250CYFFR
vs
MP2624AGL
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MONOLITHIC POWER SYSTEMS INC
|
| Package Description |
VFBGA,
|
QFN-22
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Adjustable Threshold |
YES
|
YES
|
| Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT
|
POWER SUPPLY MANAGEMENT CIRCUIT
|
| Input Voltage-Max |
10.5 V
|
|
| Input Voltage-Min |
4.35 V
|
|
| JESD-30 Code |
R-PBGA-B30
|
R-XQCC-N22
|
| JESD-609 Code |
e1
|
|
| Length |
2.3875 mm
|
4 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
30
|
22
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
VFBGA
|
VQCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
CHIP CARRIER, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Seated Height-Max |
0.625 mm
|
1 mm
|
| Supply Current-Max (Isup) |
5 mA
|
|
| Supply Voltage-Max (Vsup) |
10.5 V
|
7 V
|
| Supply Voltage-Min (Vsup) |
4.35 V
|
3.9 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
BUCK
|
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Threshold Voltage-Nom |
+3.35V
|
+3V
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
1.9875 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8542.39.00.01
|
| Package Equivalence Code |
|
LCC22,.16X.12,20
|
|
|
|
Compare BQ24250CYFFR with alternatives
Compare MP2624AGL with alternatives