BQ24156AYFFT
vs
UCS2113-2-V/G4
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
BGA
|
|
| Package Description |
DSBGA-20
|
HVQCCN, LCC20,.16SQ,20
|
| Pin Count |
20
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.31.00.01
|
| Adjustable Threshold |
YES
|
YES
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
| JESD-30 Code |
R-XBGA-B20
|
S-PQCC-N20
|
| JESD-609 Code |
e1
|
|
| Length |
2.14 mm
|
4 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
1
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
HVQCCN
|
| Package Equivalence Code |
BGA20,4X5,16
|
LCC20,.16SQ,20
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.625 mm
|
1 mm
|
| Supply Current-Max (Isup) |
5 mA
|
|
| Supply Voltage-Max (Vsup) |
9 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
2 mm
|
4 mm
|
| Base Number Matches |
1
|
1
|
| Factory Lead Time |
|
7 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Threshold Voltage-Nom |
|
+4V
|
|
|
|
Compare BQ24156AYFFT with alternatives
Compare UCS2113-2-V/G4 with alternatives