BM77SPPS3MC2-0008AA
vs
BM77SPP03MC2-0009AA
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
MODULE-33
|
MODULE-30
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Data Rate |
112 Mbps
|
112 Mbps
|
JESD-30 Code |
R-XXMA-N30
|
R-XXMA-N30
|
Length |
15 mm
|
15 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
30
|
30
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
-20 °C
|
-20 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
XMA
|
XMA
|
Package Equivalence Code |
MODULE,30LEAD(UNSPEC)
|
MODULE,30LEAD(UNSPEC)
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
Seated Height-Max |
1.86 mm
|
1.86 mm
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
1.1 mm
|
1.1 mm
|
Terminal Position |
UNSPECIFIED
|
UNSPECIFIED
|
Width |
12 mm
|
12 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Moisture Sensitivity Level |
|
2
|
Peak Reflow Temperature (Cel) |
|
250
|
|
|
|
Compare BM77SPPS3MC2-0008AA with alternatives
Compare BM77SPP03MC2-0009AA with alternatives