BM77SPP03MC2-0004AA
vs
BM77SPP03MC2-000AAA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
MODULE-30
MODULE-30
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Data Rate
112 Mbps
112 Mbps
JESD-30 Code
R-XXMA-N30
R-XXMA-N30
Length
15 mm
15 mm
Moisture Sensitivity Level
2
Number of Functions
1
1
Number of Terminals
30
30
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
-20 °C
-20 °C
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
XMA
XMA
Package Equivalence Code
MODULE,30LEAD(UNSPEC)
MODULE,30LEAD(UNSPEC)
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Cel)
250
Seated Height-Max
1.86 mm
1.86 mm
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Telecom IC Type
TELECOM CIRCUIT
TELECOM CIRCUIT
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.1 mm
1.1 mm
Terminal Position
UNSPECIFIED
UNSPECIFIED
Width
12 mm
12 mm
Base Number Matches
1
1
Compare BM77SPP03MC2-0004AA with alternatives
Compare BM77SPP03MC2-000AAA with alternatives