BLV75/12 vs MRF317 feature comparison

BLV75/12 NXP Semiconductors

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MRF317 Motorola Mobility LLC

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Package Description FLANGE MOUNT, O-CXFM-F6 FLANGE MOUNT, O-CXFM-F4
Pin Count 6
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
Case Connection ISOLATED
Collector Current-Max (IC) 15 A 12 A
Collector-Emitter Voltage-Max 16.5 V 35 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 15 10
Highest Frequency Band VERY HIGH FREQUENCY BAND VERY HIGH FREQUENCY BAND
JESD-30 Code O-CXFM-F6 O-CXFM-F4
Number of Elements 1 1
Number of Terminals 6 4
Operating Temperature-Max 200 °C 150 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Shape ROUND ROUND
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type NPN NPN
Power Dissipation-Max (Abs) 150 W 270 W
Power Gain-Min (Gp) 6.5 dB 9 dB
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form FLAT FLAT
Terminal Position UNSPECIFIED UNSPECIFIED
Transistor Application AMPLIFIER AMPLIFIER
Transistor Element Material SILICON SILICON
Base Number Matches 4 5
HTS Code 8541.29.00.75
Collector-Base Capacitance-Max 250 pF
Power Dissipation Ambient-Max 270 W
Transition Frequency-Nom (fT) 150 MHz

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