BLV193
vs
MRF859
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
MOTOROLA INC
|
Package Description |
,
|
FLANGE MOUNT, R-CDFM-F6
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
Collector Current-Max (IC) |
3.5 A
|
|
Configuration |
SINGLE
|
SINGLE
|
DC Current Gain-Min (hFE) |
25
|
20
|
Number of Elements |
1
|
1
|
Operating Temperature-Max |
200 °C
|
200 °C
|
Polarity/Channel Type |
NPN
|
NPN
|
Power Dissipation-Max (Abs) |
44 W
|
34 W
|
Surface Mount |
NO
|
YES
|
Base Number Matches |
3
|
4
|
HTS Code |
|
8541.29.00.75
|
Collector-Base Capacitance-Max |
|
26 pF
|
Collector-Emitter Voltage-Max |
|
30 V
|
Highest Frequency Band |
|
ULTRA HIGH FREQUENCY BAND
|
JESD-30 Code |
|
R-CDFM-F6
|
Number of Terminals |
|
6
|
Package Body Material |
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
FLANGE MOUNT
|
Power Dissipation Ambient-Max |
|
34 W
|
Power Gain-Min (Gp) |
|
11.5 dB
|
Qualification Status |
|
Not Qualified
|
Terminal Form |
|
FLAT
|
Terminal Position |
|
DUAL
|
Transistor Application |
|
AMPLIFIER
|
Transistor Element Material |
|
SILICON
|
|
|
|
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