BLV13
vs
SD1070
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICROSEMI CORP
|
| Package Description |
FLANGE MOUNT, O-CRFM-F4
|
POST/STUD MOUNT, O-MUPM-P3
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Case Connection |
ISOLATED
|
|
| Collector Current-Max (IC) |
8 A
|
3 A
|
| Collector-Emitter Voltage-Max |
16.5 V
|
40 V
|
| Configuration |
SINGLE
|
SINGLE
|
| DC Current Gain-Min (hFE) |
15
|
|
| Highest Frequency Band |
VERY HIGH FREQUENCY BAND
|
ULTRA HIGH FREQUENCY BAND
|
| JESD-30 Code |
O-CRFM-F4
|
O-MUPM-P3
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
4
|
3
|
| Operating Temperature-Max |
200 °C
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
FLANGE MOUNT
|
POST/STUD MOUNT
|
| Polarity/Channel Type |
NPN
|
NPN
|
| Power Gain-Min (Gp) |
8.5 dB
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
FLAT
|
PIN/PEG
|
| Terminal Position |
RADIAL
|
UPPER
|
| Transistor Application |
AMPLIFIER
|
AMPLIFIER
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Transition Frequency-Nom (fT) |
1650 MHz
|
175 MHz
|
| Base Number Matches |
3
|
2
|
| Part Package Code |
|
TO-60
|
| Pin Count |
|
3
|
| Collector-Base Capacitance-Max |
|
20 pF
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare BLV13 with alternatives
Compare SD1070 with alternatives