BLU2010P-3200-AB25W
vs
UPTF2010-2W-E-3200AT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
RCD COMPONENTS INC
VENKEL LTD
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
Construction
Chip
Chip
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.61 mm
0.55 mm
Package Length
5 mm
5 mm
Package Style
SMT
SMT
Package Width
2.5 mm
2.5 mm
Packing Method
Bulk
TR, EMBOSSED, 7 INCH
Rated Power Dissipation (P)
0.5 W
0.5 W
Resistance
320 Ω
320 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
2010
2010
Surface Mount
YES
YES
Technology
THIN FILM
THIN FILM
Temperature Coefficient
25 ppm/°C
25 ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
0.05%
0.05%
Working Voltage
150 V
150 V
Base Number Matches
1
1
Package Description
CHIP
Samacsys Manufacturer
Venkel
Additional Feature
ULTRA PRECISION
Package Shape
RECTANGULAR PACKAGE
Rated Temperature
70 °C
Compare BLU2010P-3200-AB25W with alternatives
Compare UPTF2010-2W-E-3200AT with alternatives