BLU0805P-2003-FB50Q
vs
BLU0805-2003-FB50
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Active
Active
Ihs Manufacturer
RCD COMPONENTS INC
RCD COMPONENTS INC
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
Construction
Chip
Chip
JESD-609 Code
e0
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.45 mm
0.45 mm
Package Length
2 mm
2 mm
Package Style
SMT
SMT
Package Width
1.25 mm
1.25 mm
Packing Method
Bulk
BULK
Rated Power Dissipation (P)
0.125 W
0.125 W
Resistance
200000 Ω
200000 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0805
0805
Surface Mount
YES
YES
Technology
THIN FILM
THIN FILM
Temperature Coefficient
50 ppm/°C
50 ppm/°C
Terminal Finish
Tin/Lead (Sn90Pb10) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
1%
1%
Working Voltage
100 V
100 V
Base Number Matches
1
1
Package Description
CHIP
HTS Code
8533.21.00.30
Additional Feature
ULTRA PRECISION
Package Shape
RECTANGULAR PACKAGE
Rated Temperature
70 °C
Compare BLU0805P-2003-FB50Q with alternatives
Compare BLU0805-2003-FB50 with alternatives