BLF7G20L-200 vs BLF7G20LS-200 feature comparison

BLF7G20L-200 NXP Semiconductors

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BLF7G20LS-200 Ampleon

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS AMPLEON NETHERLANDS B V
Package Description FLANGE MOUNT, R-CDFM-F2 FLATPACK, R-CDFP-F2
Pin Count 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
Additional Feature ESD PROTECTED ESD PROTECTED
Case Connection SOURCE SOURCE
Configuration SINGLE SINGLE
DS Breakdown Voltage-Min 65 V 65 V
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band L BAND L BAND
JESD-30 Code R-CDFM-F2 R-CDFP-F2
Number of Elements 1 1
Number of Terminals 2 2
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Operating Temperature-Max 225 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLATPACK
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Polarity/Channel Type N-CHANNEL N-CHANNEL
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form FLAT FLAT
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Transistor Application AMPLIFIER AMPLIFIER
Transistor Element Material SILICON SILICON
Base Number Matches 3 3
Moisture Sensitivity Level NOT APPLICABLE

Compare BLF7G20L-200 with alternatives

Compare BLF7G20LS-200 with alternatives