BLF246B
vs
MRF175GU
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
M/A-COM TECHNOLOGY SOLUTIONS INC
Package Description
FLANGE MOUNT, R-CDFM-F8
CASE 375-04, 4 PIN
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.29.00.75
Additional Feature
HIGH RELIABILITY
Case Connection
ISOLATED
SOURCE
Configuration
COMMON SOURCE, 2 ELEMENTS
COMMON SOURCE, 2 ELEMENTS
DS Breakdown Voltage-Min
65 V
65 V
Drain Current-Max (ID)
8 A
26 A
Drain-source On Resistance-Max
0.75 Ω
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band
VERY HIGH FREQUENCY BAND
ULTRA HIGH FREQUENCY BAND
JESD-30 Code
R-CDFM-F8
R-CDFM-F4
Number of Elements
2
2
Number of Terminals
8
4
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Operating Temperature-Max
200 °C
200 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLANGE MOUNT
FLANGE MOUNT
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Power Dissipation Ambient-Max
130 W
Power Dissipation-Max (Abs)
130 W
400 W
Power Gain-Min (Gp)
14 dB
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Form
FLAT
FLAT
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Transistor Application
AMPLIFIER
AMPLIFIER
Transistor Element Material
SILICON
SILICON
Base Number Matches
2
1
Pin Count
4
Manufacturer Package Code
CASE 375-04
Compare BLF246B with alternatives
Compare MRF175GU with alternatives