BH7884EFV-E2
vs
BH7884EFV
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ROHM CO LTD
|
ROHM CO LTD
|
| Part Package Code |
TSSOP
|
TSSOP
|
| Package Description |
HTSSOP-24
|
HVSSOP, TSSOP24,.3
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
ROHM Semiconductor
|
|
| Consumer IC Type |
TONE CONTROL CIRCUIT
|
TONE CONTROL CIRCUIT
|
| Harmonic Distortion |
0.1%
|
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G24
|
| Length |
7.8 mm
|
7.8 mm
|
| Number of Bands |
1
|
1
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
-10 °C
|
-10 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSSOP
|
HVSSOP
|
| Package Equivalence Code |
TSSOP24,.3
|
TSSOP24,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Current-Max |
18 mA
|
18 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
5.6 mm
|
5.6 mm
|
| Base Number Matches |
1
|
2
|
| JESD-609 Code |
|
e2
|
| Terminal Finish |
|
Tin/Copper (Sn/Cu)
|
|
|
|