BGM1014
vs
BGM1014,115
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
PLASTIC, SC-88, SOT-363, 6 PIN
|
PLASTIC, SC-88, SOT-363, 6 PIN
|
| Reach Compliance Code |
compliant
|
compliant
|
| Additional Feature |
LOW NOISE
|
LOW NOISE
|
| Characteristic Impedance |
50 Ω
|
50 Ω
|
| Construction |
COMPONENT
|
COMPONENT
|
| Gain |
25 dB
|
25 dB
|
| Input Power-Max (CW) |
-10 dBm
|
-10 dBm
|
| JESD-609 Code |
e3
|
e3
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
6
|
| Operating Frequency-Max |
3000 MHz
|
3000 MHz
|
| Operating Frequency-Min |
100 MHz
|
100 MHz
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Equivalence Code |
TSSOP6,.08
|
TSSOP6,.08
|
| Power Supplies |
5 V
|
5 V
|
| RF/Microwave Device Type |
WIDE BAND LOW POWER
|
WIDE BAND LOW POWER
|
| Supply Current-Max |
25 mA
|
25 mA
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Terminal Finish |
Tin (Sn)
|
Tin (Sn)
|
| Base Number Matches |
3
|
1
|
| Part Package Code |
|
TSSOP
|
| Pin Count |
|
6
|
| Manufacturer Package Code |
|
SOT363
|
| HTS Code |
|
8542.33.00.01
|
| Samacsys Manufacturer |
|
NXP
|
|
|
|
Compare BGM1014 with alternatives
Compare BGM1014,115 with alternatives